Introduction
The Contac S4 is a machine used to copper plate vias in circuit boards using electrolysis. It uses a 5 step chemical procedure that takes around 3 hours to complete.
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The Contac S4 is used to plate the insides of the board's drilled vias with copper so that they create a connection between traces on the top of the board and traces on the bottom of the board.
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The power switch is located on the right side of the machine
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Ensure all baths are filled to the required levels. Top off with chemicals (or inform a trained staff member) if necessary:
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Bath 1 takes cleaner 110
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Bath 2 takes cleaner 210
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Bath 3 takes activator 310
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Bath 4 takes via cleaner
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Bath 5 takes copper plater 400
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Bath 6 takes tin plater (not used in this guide)
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On the touchscreen interface, push the menu icon in the upper left corner
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Select "Profiles"
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Select "Copper Plating Profile"
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Mount the board in the PCB handle located on the left side of the machine
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Insert the long side into the clamps and tighten with an Allen wrench
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Rinse the board with tap water
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Take the lid off bath 1
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Place the board into bath 1 and press play
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Once phase 1 is complete, remove the board from bath 1 and rinse it with tap water
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Place the board into bath 2 and press play
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Once phase 2 is complete, remove the board from bath 2 and rinse it with tap water
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Dry the board with a heat gun
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Place the board into bath 3 and press play
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Once bath 3 is complete, lift the board out of the bath and scrape ink off the surface back into the bath
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Transfer to a tub and scrape off any remaining ink
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Dry the board and then place into bath 4 and press play
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Once bath 4 is complete, remove the board
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Dry the board with a heat gun
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Gently wipe the surface with a moist towel to remove as much black ink as possible
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Place the board into bath 5 and press play
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Once bath 5 is finished, remove the board
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Rinse with tap water and dry with a heat gun
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The via plating process is now complete
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