Contac S4

Written By: Jimmy Nolan (and one other contributor)

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Difficulty

Easy

Steps

Time Required

03:00:00 - 04:00:00

Introduction

The Contac S4 is a machine used to copper plate vias in circuit boards using electrolysis. It uses a 5 step chemical procedure that takes around 3 hours to complete.

Step 1 Power on

The Contac S4 is used to plate the insides of the board's drilled vias with copper so that they create a connection between traces on the top of the board and traces on the bottom of the board.

The power switch is located on the right side of the machine

The Contac S4 is used to plate the insides of the board's drilled vias with copper so that they create a connection between traces on the top of the board and traces on the bottom of the board.
The power switch is located on the right side of the machine
Allow the machine to warm up for 15 minutes on power on

Step 2 Check the baths

Ensure all baths are filled to the required levels. Top off with chemicals (or inform a trained staff member) if necessary:

Ensure all baths are filled to the required levels. Top off with chemicals (or inform a trained staff member) if necessary:
Bath 1 takes cleaner 110
Bath 2 takes cleaner 210
Bath 3 takes activator 310
Bath 4 takes via cleaner
Bath 5 takes copper plater 400
Bath 6 takes tin plater (not used in this guide)

Step 3 Select profile

On the touchscreen interface, push the menu icon in the upper left corner

On the touchscreen interface, push the menu icon in the upper left corner
Select "Profiles"
Select "Copper Plating Profile"

Step 4 Bath 1

Mount the board in the PCB handle located on the left side of the machine

Insert the long side into the clamps and tighten with an Allen wrench

Mount the board in the PCB handle located on the left side of the machine
Insert the long side into the clamps and tighten with an Allen wrench
Rinse the board with tap water
Take the lid off bath 1
Place the board into bath 1 and press play

Step 5 Bath 2

Once phase 1 is complete, remove the board from bath 1 and rinse it with tap water

Place the board into bath 2 and press play

Once phase 1 is complete, remove the board from bath 1 and rinse it with tap water
Place the board into bath 2 and press play

Step 6 Bath 3

Once phase 2 is complete, remove the board from bath 2 and rinse it with tap water

Hit the board on a hard surface while drying to ensure no air bubbles are trapped inside the vias

Once phase 2 is complete, remove the board from bath 2 and rinse it with tap water
Dry the board with a heat gun
Hit the board on a hard surface while drying to ensure no air bubbles are trapped inside the vias
Place the board into bath 3 and press play

Step 7 Bath 4

Once bath 3 is complete, lift the board out of the bath and scrape ink off the surface back into the bath

Transfer to a tub and scrape off any remaining ink

We want ink to remain inside the vias and nowhere else because the copper will get deposited on the ink

Once bath 3 is complete, lift the board out of the bath and scrape ink off the surface back into the bath
Transfer to a tub and scrape off any remaining ink
We want ink to remain inside the vias and nowhere else because the copper will get deposited on the ink
Dry the board and then place into bath 4 and press play
The quality of the copper plating depends on how dry the ink is, so ensure the board is as dry as possible before starting bath 4

Step 8 Bath 5

Once bath 4 is complete, remove the board

Once bath 4 is complete, remove the board
Dry the board with a heat gun
Hit the board on a hard surface while drying to ensure no air bubbles are trapped inside the vias
Again, the quality of the plating will depend on how dry the insides of the vias are
Gently wipe the surface with a moist towel to remove as much black ink as possible
Do not press into the holes on the board; we want the dry black ink to remain in the holes
Place the board into bath 5 and press play
Halfway through the two hour plating process the Contac will pause so you can rotate the board 180 degrees and press play again