Nanoscribe GT+ Upgrade

The Nanoscribe has been upgraded to extend its capabilities to match those of the PPGT2, making it compatible with the 3D Large Features (LF) solution set. The major hardware and workflow changes associated with this upgrade will be discussed in the following sections.

For additional information, you can refer to the NanoGuide portal; all accounts connected with the University of Maryland should now have access to the PPGT2 content.

A protective enclosure for the microscope and piezo stage was added as part of the upgrade. It includes the electrical cabinet and safety precedence sequence (SPS) panel (top picture), as well as the top hatch (bottom picture). In addition to providing the print chamber with protection from dust and other external influences, these components introduce new safety features.

There is also a new piezo stage design, which allows the objective to be accessed from above and large prints or custom substrates to be removed safely from the printer.

While NanoWrite is open, the SPS will be activated; it will cause a green light on the “Process” button to appear whenever the Nanoscribe is in use. It will turn off when the piezo is in a safe state (i.e. when the “Exchange Holder” window is showing).

The top hatch has a safety lock that must be disarmed by pressing the “Open” button on the electrical cabinet once the green “Process” light turns off. When the white ring around the button flashes, gently guide the top up to an upright position.

Note: If any of the hatches remain open while you are printing, the SPS places the printer into a “safe state,” which shutters the laser emission and results in an error message. Should this occur, check to make sure that all components of the protective enclosure are secured and the the light of the open button is off when you’re trying to print.

The objective turret is now accessed from above, so the objective will be mounted in the same position as it’s used to print.

1. Ensure that the microscope z-drive is lowered.
2. Select the position of the desired objective.
3. Turn the piezo clamps (red arrows) outwards.
4. Pull the pin (blue arrows) slightly and at the same time, use the white handle to open the piezo flap to 90° (bottom picture).
   • The pin will snap into place again to hold the stage up.
5. Insert or remove the objective.
6. Pull the pin slightly while moving the stage to its default position; reset the clamps.

Note: Always move the piezo flap using the dedicated piezo handle. Pulling it upwards using the handle of the sample holder will damage the piezo.

For 63x, 25x, and some 10x prints, the sample holders can be loaded and unloaded normally (with the piezo flap down). For tall 10x prints, the sample holders are loaded normally and can be removed at an angle to avoid damaging the parts:

1. Turn the piezo clamps outwards
2. Lift up the stage using the white handle
3. Rotate the clamps and rest the stage on top of them (see picture below)
4. Remove sample holder
5. Reset the stage to its default position

Note: Tilting the piezo stage can also be used for loading and unloading custom substrate setups that are difficult to do otherwise.

The recipes used for slicing STLs to be printed with the 10x are available for download on the 3D LF NanoGuide page. The linked page also has more detailed information about printing with the 3D LF solution set.

Silicon substrates and IP-Q are used with the 10x objective. The substrates can be cleaned as normal (e.g. acetone/IPA/water), and the multi-DiLL sample holder is used with the 25mm x 25mm Nanoscribe slides. There is a sample holder available for 2” wafers, but the exchange holder settings have not been set up yet; please contact terrapinworks@umd.edu if you plan to print with these.

In order to avoid dripping on the Nanoscribe components, only one to two drops of IP-Q should be placed on the polished side of the slide. If more resin is needed for the print, it can be added to the objective directly.

Running a print with the 10x objective is similar to the 63x and 25x, but has a few additional general requirements:

• Use the Multi DiLL Si Wafer sample holder setting in the exchange holder window.
• Do not use other objectives with the 10x; moving the objective could cause the resin stop to crash into the piezo stage.
• For larger prints, place additional drops of IP-Q onto the center of the objective after it is mounted.
• If large amounts of IP-Q or multiple slides are used, secure the nosepiece cover (shown below) over the objective turret.
  • The cover is stored in the cabinet behind the microfiber cloths.
  • You may need to remove the other objective caps to make the cover fit properly.

The standard times for developing 10x prints are 20 minutes in PGMEA and 5 minutes in IPA.

The 10x objective can be cleaned using the standard objective cleaning procedure. Excess resist on the resin stop can be rinsed off using IPA.