ProtoPrint S

The ProtoPrint stencil rig is used to secure a milled solder paste stencil above your PCB.

Solder paste is spread over the stencil and deposited nicely on the pads of your PCB so that you can easily solder components.

Create a new file with the Stencil QR 266x38 template.

Import your top/bottom solder paste layers and position them side by side in the center.

Open the technology dialogue box.

Select basic insulation.

Set the primary tool as the 0.1mm micro cutter.

Uncheck Process in the Contour Routing tab.

Click Start.

Tape the polyimide foil to a piece of cardboard.

Measure the thickness of the foil + cardboard combination.

Secure it to the bed of the ProtoMat.

Open Edit->Material Settings.

Enter the total thickness you measured in the previous step.

Enter 100um into the copper thickness field.

In Machine view, choose the MountMaterial phase.

Press the play button to start the routing process and follow the on-screen instructions.

The process is similar to the trace milling process.

Once finished, remove the stencil from the ProtoMat and place it in the ProtoPrint.

To release the plates, push the pins on the opposite side against a table and slide the plate to the side.

Due to the alignment of the holes, there is only one way the stencil can be placed into the frame.

Place the frame in the ProtoPrint and secure it with the three levers.

Remove the clear plastic protective shield by squeezing and pulling up.

Align the magnetic holders to the four corners of the board.

Alternatively, there are spikes you can use on through holes.

Replace the clear plastic shield and use the handle to push the gantry containing the board underneath the stencil.

Use the knobs on the left side to precisely align the PCB to the stencil.

When ready, pull the lever on the right to raise the PCB.

Use a glove to place a small glob of solder paste on the stencil.

Test the alignment by doing a test run with the clear plastic shield intact.

Spread the solder paste over the stencil.

Lower the gantry and pull it to the left. Inspect where the solder was laid.

If it looks good, remove the clear plastic shield and push the gantry back under the stencil for another run.

Remove the PCB from the ProtoPrint S

Clean the spreader, plastic shield, and stencil using an IPA wipe.

Now that you have a PCB with nicely laid solder paste, the next step is to place components using the ProtoPlace S.