ProtoPlace S

The ProtoPlace S (commonly referred to as the "Pick and Place Machine") is used to place components onto a PCB using a pressurized needle.

The needle is moved by hand along two rails on the X and Y axis.

Before using the machine, your board should already have solder paste applied to its pads.

That way you can place your components on top of the solder paste and then melt the solder paste in our reflow oven to create a strong electrical connection.

Our preferred method of applying solder paste is with the ProtoPrint S

Manipulator - Moves to pick up and place components with a small vacuum suction nozzle.

Micro-table - Fixes the board in place between two laths.

The empty area to the right can be used for palettes with components

Micro-table knobs - The right one moves the table along the x axis and the left one moves the table along the y axis.

Table position indicator - Shows how far the knobs have moved the micro table off the coordinate origin.

Air regulation - Turn these knobs to adjust the pressure of the nozzle.

Turntable - Can store up to 90 individual components.

LCD display (hidden) - Controlled with the keypad.

The power switch is located on the backside of the machine.

Ensure the monitor, turntable, and foot switch are plugged in.

Turn on the machine and the monitor. It should start displaying an image.

Release the right lath by unscrewing the knobs.

Adjust it until the board lays firmly between the two laths.

Tighten the laths.

Individual components can be loaded into the turntable.

Component tapes can be loading into the tape feeders.

Palettes can be placed in the empty area on the micro-table.

Push the left arrow button to enter place mode

Dispense mode is used for dispensing solder paste, which we do not use

Select auto to let the machine activate/deactivate the suction for you or man if you would rather control it with the foot pedal

In auto mode, you can use the right arrow button to turn the brake on and the top arrow to move the turntable

Move the manipulator over the desired component and push down the picking needle to pick it up.

The vacuum suction will start automatically as you push down. Adjust the vacuum pressure with the "pick vacuum" knob

Move the component over to its location on the PCB and lower it as close as you can without touching the board. Turn the brake on.

Use the knobs on the bottom of the machine to precisely line up the board with the picking needle.

Rotate the component until it is in the correct orientation and select "Place" to automatically place it.

Move the manipulator out of the way and unscrew the right lath to release the board.

Now that you have a board with components placed on it the next step is to melt the solder paste using the ProtoFlow S N2.